Radiator device

ABSTRACT

A radiator device has a heat conductive interface and a plurality of radiation fins. Each of the radiation fins which has a molecular polymeric form is made by a metal granular metallurgy.

BACKGROUND OF THE INVENTION

[0001] The present invention relates to a radiator device. More particularly, the present invention relates to a radiator device for a chip of a central processor unit.

[0002] Referring to FIGS. 1 and 2, a conventional radiator device 1 has a heat conductive interface 10 and a plurality of radiation fins 11. A fan 2 is disposed on the conventional radiator device 1. However, the conventional radiator device 1 cannot radiate heat very effectively. Therefore, it requires a large radiation area.

SUMMARY OF THE INVENTION

[0003] An object of the present invention is to provide a radiator device which radiates heat effectively.

[0004] In accordance with a first embodiment of the present invention, a radiator device comprises a heat conductive interface and a plurality of radiation fins. Each of the radiation fins has a molecular polymeric form.

[0005] In accordance with a second embodiment of the present invention, a radiator device comprises a heat conductive interface and a radiation block. The radiation block which has a molecular polymeric form is made by a metal granular metallurgy.

BRIEF DESCRIPTION OF THE DRAWINGS

[0006]FIG. 1 is a perspective exploded view of a fan and a radiator device of the prior art;

[0007]FIG. 2 is a perspective assembly view of a fan and a radiator device of the prior art;

[0008]FIG. 3 is a perspective exploded view of a fan and a radiator device of a preferred embodiment in accordance with the present invention;

[0009]FIG. 3A is an enlarged view of a portion of a radiation fin of a preferred embodiment in accordance with the present invention;

[0010]FIG. 3B is another enlarged view of a portion of a radiation fin of a preferred embodiment in accordance with the present invention;

[0011]FIG. 4 is a perspective assembly view of a fan and a radiator device of a preferred embodiment in accordance with the present invention; and

[0012]FIG. 5 is a perspective assembly view of a fan and a radiator device of another preferred embodiment in accordance with the present invention.

DETAILED DESCRIPTION OF THE INVENTION

[0013] Referring to FIGS. 3, 3A, 3B and 4, a radiator device 3 comprises a heat conductive interface 30 and a plurality of radiation fins 31.

[0014] Each of the radiation fins 31 which has a molecular polymeric form is made by a metal granular metallurgy.

[0015] Therefore, each of the radiation fins 31 has a porous structure in order to radiate heat effectively.

[0016] A fan 4 is disposed on the radiator device 3.

[0017] Referring to FIG. 5, another radiator device 3′ comprises a heat conductive interface 30′ and a radiation block 31′.

[0018] The radiation block 31′ which has a molecular polymeric form is made by a metal granular metallurgy.

[0019] A fan 4′ is disposed on the radiator device 3′.

[0020] The invention is not limited to the above embodiment but various modification thereof may be made. Further, various changes in form and detail may be made without departing from the scope of the invention. 

I claim:
 1. A radiator device comprises: a heat conductive interface and a plurality of radiation fins, and each of the radiation fins having a molecular polymeric form.
 2. A radiator device comprises: a heat conductive interface and a radiation block, and the radiation block having a molecular polymeric form. 